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  • 匿名
关注:1 2013-05-23 12:21

求翻译:拆下元件,用鑽頭打穿元件與PCB,將溫度線埋於孔內,并用紅膠固定,線頭不高於PAD表面,更換新物料貼裝是什么意思?

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拆下元件,用鑽頭打穿元件與PCB,將溫度線埋於孔內,并用紅膠固定,線頭不高於PAD表面,更換新物料貼裝
问题补充:

  • 匿名
2013-05-23 12:21:38
Remove the components, the drill bit penetrated the components and the pcb, the temperature line buried in a hole, and fixed with a red plastic, the thread above the pad surface, the replacement of the placement of new materials
  • 匿名
2013-05-23 12:23:18
Removal of components, a bit punch through components and PCB, will be buried in temperature line holes in 并 with red plastic fixed, line and no higher than PAD surface, replaced with new material-mount
  • 匿名
2013-05-23 12:24:58
Dismantles the part, punctures the part and PCB with the drill bit, buries the temperature line in the hole, and is fixed with the red rubber, the end of a thread is not higher than the PAD surface, replaces the new material to paste the attire
  • 匿名
2013-05-23 12:26:38
Remove components, components and PCB drill wear and temperature lines buried in a hole, and red plastic fixed, lint is not higher than the surface of the PAD, replace the item with a new mount
  • 匿名
2013-05-23 12:28:18
正在翻译,请等待...
 
 
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