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  • 匿名
关注:1 2013-05-23 12:21

求翻译:1.建議將圖3所示位置小圓孔D取消,以增加銘牌與鎂件的接觸面積。2.建議將圖3所示3個小圓孔A、B、C直徑由2.0mm減小至1.5mm,防止銘牌壓凹陷。是什么意思?

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1.建議將圖3所示位置小圓孔D取消,以增加銘牌與鎂件的接觸面積。2.建議將圖3所示3個小圓孔A、B、C直徑由2.0mm減小至1.5mm,防止銘牌壓凹陷。
问题补充:

  • 匿名
2013-05-23 12:21:38
Figure 3 shows the location of small hole d canceled, in order to increase the contact area of ​​the nameplate and magnesium. Recommended that Figure 3 shows the small hole a, b, c diameter decreases from 2.0mm to 1.5mm, to prevent the nameplate pressure depression.
  • 匿名
2013-05-23 12:23:18
1. recommendations will be shown in Figure 3 position small round holes D canceled, to increase name plate with magnesium parts of the contact area. 2. recommendations will be shown in Figure 3 three small round holes A, B, C diameter from 2.0 mm reduced to 1.5 mm to prevent name plate pressure defe
  • 匿名
2013-05-23 12:24:58
正在翻译,请等待...
  • 匿名
2013-05-23 12:26:38
1. it is recommended that the location shown in Figure 3 small round holes d cancel, to increase the contact area of nameplates and magnesium parts. 2. it is proposed that as shown in Figure 3-3 small circular aperture diameter a, b, c from 2.0mm reduced to 1.5mm to prevent nameplate voltage SAG.
  • 匿名
2013-05-23 12:28:18
1. suggestions shown in Figure 3 position small round hole D to cancel, increases the data plate and the magnesium contacted area.2. suggestions shown in Figure 3 3 small round hole A, B, the C diameter reduces by 2.0mm to 1.5mm, prevented the data plate presses hollowly.
 
 
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