求翻译：其实不良样品的制程是可以偵測出來的.但是由于我们对你们的装配要求及焊锡部位不了解，导致做吃锡试验的的方法不一样，而流入下工序是什么意思？

In fact, the process of bad samples can detect out, but because we do not know your assembly requirements and solder parts do eat tin test, and into the next process

In fact, a bad sample can be detected is out of him, but the result of our Assembly requirements for you and do not know where solder, tin-lead to eating the way the test is not the same as the operation flow, and

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In fact bad sample process can 偵 test out come. but because of our requirements for your Assembly and soldering site does not understand, cause eating Tin test method is different, and flows down processes

Actually not the good sample system regulation is may detect. But because we did not understand to your matching requirement and the soldering tin spot, causes does eats the tin experiment the method not to be dissimilar, but under inflow working procedure