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关注：1
2013-05-23 12:21
求翻译：Device for polishing edge of semiconductor substrate, has polishing pad that is arranged such that its cross-section in plane perpendicular to surface of substrate holder is curved是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
Device for polishing edge of semiconductor substrate, has polishing pad that is arranged such that its cross-section in plane perpendicular to surface of substrate holder is curved
问题补充： |
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2013-05-23 12:21:38
设备用于抛光半导体衬底的边缘，并抛光，其被布置这样的垫，其在垂直于衬底保持器的表面的横截面是弯曲的
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2013-05-23 12:23:18
擦亮的半导体基体边缘设备，有安排这样的抛光模它的平面垂线的横断面对基体持有人表面弯曲
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2013-05-23 12:24:58
设备为擦亮半导体基体边缘，有安排这样的擦亮的垫它的横断面在平面垂线对基体持有人表面弯曲
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2013-05-23 12:26:38
抛光的半导体基片表面，边缘设备有抛光被安排的其截面平面垂直于基板持有人的表面弯曲的垫
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2013-05-23 12:28:18
正在翻译，请等待...
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