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关注：1
2013-05-23 12:21
求翻译：这些测试能够模拟跌落半导体器件和封装失效，目的是能够相对于一般条件加速跌落失效是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
这些测试能够模拟跌落半导体器件和封装失效，目的是能够相对于一般条件加速跌落失效
问题补充： |
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2013-05-23 12:21:38
The drop test to simulate semiconductor device and package failure, the purpose is to accelerate the fall relative to the failure of the general conditions
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2013-05-23 12:23:18
These tests can simulate falling semiconductor devices and packaging have lapsed, the aim is to accelerate vis-à-vis the General Conditions shall lapse fell
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2013-05-23 12:24:58
These tests can simulate the depreciation semiconductor device and the seal expires, the goal is can be opposite in the generic condition acceleration depreciation expiration
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2013-05-23 12:26:38
These tests can simulate dropping failure of semiconductor devices and packaging in order relative to the General conditions for accelerated drop failure
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2013-05-23 12:28:18
These tests can simulate the depreciation semiconductor device and the seal expires, the goal is can be opposite in the generic condition acceleration depreciation expiration
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