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关注：1
2013-05-23 12:21
求翻译：懷疑貼膠壓力對於已研磨過的wafer壓力過大造成破片。是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
懷疑貼膠壓力對於已研磨過的wafer壓力過大造成破片。
问题补充： |
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2013-05-23 12:21:38
Gum paste doubt pressure has been milled for wafer pressure caused by excessive fragmentation .
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2013-05-23 12:23:18
正在翻译，请等待...
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2013-05-23 12:24:58
Suspected the rubberizing pressure regarding has ground the wafer pressure oversized has created the broken piece.
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2013-05-23 12:26:38
Suspected rubberized pressure for ground wafer fragments caused by too much stress.
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2013-05-23 12:28:18
正在翻译，请等待...
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