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关注:1
2013-05-23 12:21
求翻译:將芯片貼在上蓋圓圈的中心,左右上下都不要偏位,芯片貼好后,表面需要貼平,無氣泡,無折叠,然後將上蓋與下蓋裝配好,注意上蓋的定位柱需對正下蓋的定位孔插入,不可插偏。是什么意思?![]() ![]() 將芯片貼在上蓋圓圈的中心,左右上下都不要偏位,芯片貼好后,表面需要貼平,無氣泡,無折叠,然後將上蓋與下蓋裝配好,注意上蓋的定位柱需對正下蓋的定位孔插入,不可插偏。
问题补充: |
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2013-05-23 12:21:38
The chip attached to the cover of the circle center , left and right are not deflected up and down , posted a good chip , the surface needs to stick flat , no bubbles, no folding , then cover and lower cover assembly , pay attention to the positioning of the cover on the positive column required und
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2013-05-23 12:23:18
Pastes the chip in the center of top head circle, about does not want the displacement up and down, after the chip pastes, the surface needs to paste the draw, does not have the air bubble, does not have the fold, then assembles with below lid the top head, under pays attention to the locating colum
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2013-05-23 12:24:58
Pastes the chip in the top head circle center, about about all does not want the displacement, after the chip to paste, the surface needs to paste evenly, does not have the air bubble, does not have the fold, then assembles the top head with under lid under, pays attention to index hole insertion wh
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2013-05-23 12:26:38
Will chip in the center circle above, left and right up and down are not deflected, chip in place, need to stick on the surface, no bubbles, no folding, and then assemble lid and bottom cover, watched under cover pin needs to insert the positioning holes of the cover, do not plug too.
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2013-05-23 12:28:18
正在翻译,请等待...
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