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关注:1
2013-05-23 12:21
求翻译:The reason is that the chemical and mechanical properties of Si face and C face are different; therefore the ideal abrasives for flattening of Si faces may not be suitable for flattening of C faces. Just as the Si face of 4H-SiC substrates, we think that the C faces can also be flattened efficiently by surface oxidatio是什么意思?![]() ![]() The reason is that the chemical and mechanical properties of Si face and C face are different; therefore the ideal abrasives for flattening of Si faces may not be suitable for flattening of C faces. Just as the Si face of 4H-SiC substrates, we think that the C faces can also be flattened efficiently by surface oxidatio
问题补充: |
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2013-05-23 12:21:38
其原因是, Si面和C面的化学和机械性能是不同的;
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2013-05-23 12:23:18
正在翻译,请等待...
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2013-05-23 12:24:58
原因是Si面孔和C面孔化工和机械性能是不同的; 因此理想的研磨剂为铺平Si面孔可能不是适当的为铺平C面孔。 正4H-SiC基体的Si面孔,我们认为C面孔可能通过表面氧化作用和磨蚀擦亮高效率地也铺平,因为C面孔是更加容易被氧化。 C面孔、正极氧化作用、血浆氧化作用和热量氧化作用的氧化作用方法在研究中。 作为一项初步研究,热量氧化作用的应用结果和磨蚀擦亮SiC-C面孔在本文被谈论了。
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2013-05-23 12:26:38
正在翻译,请等待...
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2013-05-23 12:28:18
正在翻译,请等待...
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