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关注：1
2013-05-23 12:21
求翻译：Solder degradation is a typical failure mechanism in 电源模块 and leads to an increased Rth. For this reason, the entire power stack is embedded in a mold compound that stabilizes the soldered stack and thus makes it extremely reliable against thermal cycles. The mold compound is also used to form a durable second level 封装是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
Solder degradation is a typical failure mechanism in 电源模块 and leads to an increased Rth. For this reason, the entire power stack is embedded in a mold compound that stabilizes the soldered stack and thus makes it extremely reliable against thermal cycles. The mold compound is also used to form a durable second level 封装
问题补充： |
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2013-05-23 12:21:38
焊料退化是在典型的失效机理电源模块和导致增加的Rth 。
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2013-05-23 12:23:18
焊接退化是一个典型的故障机制电源模块并导致增加Rth。 由于这一原因,整个电源堆栈是嵌入在一个复合成型材料稳定的焊接堆栈,从而使其对散热非常可靠地运行周期。 该复合成型材料也可用于形成一种经久耐用封装第二级。
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2013-05-23 12:24:58
焊剂退化是一个典型的失效机理在电源模块并且导致增加的Rth。 为此，整个力量堆在稳定被焊接的堆和因而使它极端可靠反对热量周期的模子化合物被埋置。 模子化合物也用于形成一耐久的第二个层次封装。
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2013-05-23 12:26:38
焊锡退化是电源模块并且导致增加 Rth 典型失效机理。为此，整个电力堆栈被嵌入在模具化合物稳定焊接的堆栈，从而使它对热循环起着极高的可靠性。模具化合物还用于形成持久的第二个级封装。
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2013-05-23 12:28:18
正在翻译，请等待...
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