求翻译：在切削加工过程中，晶粒内部石墨颗粒引起应力集中，形成类似Pb的“切口效应”，晶界处的石墨颗粒形成微裂纹，减小晶界结合力，在力的作用下裂纹扩展，从而形成短切屑，是什么意思？

In the cutting process , the grains of graphite particles cause stress concentration, the formation of similar Pb " notch effect" , the graphite particles at the grain boundaries of the formation of micro cracks and reduce grain boundary binding force , crack propagation under the action of force ,

The cutting process, die internal graphite particles cause stress concentration, and a similar Pb "cuts" effect, crystal-to the graphite particles forming a micro-cracks, and reduce wafer together, and in their role of the cracks to form a chip.

In the machining process, the crystal grain internal graphite pellet sets up stresses the centralism, forms similar Pb “the margin effect”, the crystal boundary place graphite granulation micro crack, reduces the crystal boundary binding force, under strength function fracture growth, thus forms the

In the process of cutting, graphite particles cause stress concentration in grain form Pb-like "effect of incision" grain boundary particles of graphite micro-cracks, decreasing grain boundary adhesion, crack propagation under the action of forces, thus forming a short chip,

正在翻译，请等待...