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  • 匿名
关注:1 2013-05-23 12:21

求翻译:我們如果要將溫度降低必須要增加HEAT SINK的體積或是我們重新設計選用抗雜訊(spike noise)較好的mcu可克服此問題是什么意思?

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我們如果要將溫度降低必須要增加HEAT SINK的體積或是我們重新設計選用抗雜訊(spike noise)較好的mcu可克服此問題
问题补充:

  • 匿名
2013-05-23 12:21:38
If we want to lower the temperature necessary to increase the volume or HEAT SINK we redesigned the selection of anti- noise (spike noise) better mcu can overcome this problem
  • 匿名
2013-05-23 12:23:18
If we are to be temperatures must increase the size HEAT SINK or we re-designed for use anti-hearing (spike noise) Better MCUs can be overcome this problem
  • 匿名
2013-05-23 12:24:58
If we must have to have to increase temperature drop HEAT SINK the volume perhaps our redesign select anti-miscellaneous news( spike noise) good mcu to be possible to overcome this question
  • 匿名
2013-05-23 12:26:38
If we are to reduce the temperature must increase the volume of HEAT SINK, or we redesign the usage of noise (Spike noise) well the MCU can overcome this problem
  • 匿名
2013-05-23 12:28:18
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