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  • 匿名
关注:1 2013-05-23 12:21

求翻译:上蓋組裝時,兩個卡勾會越過下蓋邊緣的兩個凸點,由於金屬的凸點把塑膠的卡勾頂起的過高.組裝完成后卡勾與下蓋結合很緊,組裝時使塑膠產生變形而出現泛白現象.如遇不良返修時不易拆解,且機殼報廢率為100%是什么意思?

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上蓋組裝時,兩個卡勾會越過下蓋邊緣的兩個凸點,由於金屬的凸點把塑膠的卡勾頂起的過高.組裝完成后卡勾與下蓋結合很緊,組裝時使塑膠產生變形而出現泛白現象.如遇不良返修時不易拆解,且機殼報廢率為100%
问题补充:

  • 匿名
2013-05-23 12:21:38
正在翻译,请等待...
  • 匿名
2013-05-23 12:23:18
Superstructure assembled, two card application Cross of the edge cover two Braille, the metal and plastic to the card application top of the excessive. assembled 后 card application with the cover of tight, assembled the plastic produce deformation of the Pan-white. In the event negative returns, not
  • 匿名
2013-05-23 12:24:58
When the top head assembles, two trips can under the overstepping cover the edge two salient points, because the metal salient point jacks excessively high the revertex trip. After the assembly completes the trip to cover the union with under to be very tight, when assembly causes the revertex to ha
  • 匿名
2013-05-23 12:26:38
Upper cover Assembly, will cross the lower edges of two cards two salient points, due to metal bumping hook up plastic cards are too high. After assembling the card with the lower cover with a tight, plastic deformation and appear white when an Assembly. in case of bad repair when dismantling, and t
  • 匿名
2013-05-23 12:28:18
正在翻译,请等待...
 
 
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