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关注：1
2013-05-23 12:21
求翻译：This “in-process” and “on-wafer” testing has become highly sophisticated, with special test structures typically incorporated in the kerf areas between individual dies on a wafer, so that during fabrication, measurements made on these structures can determine if device performance will fall within specification limits.是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
This “in-process” and “on-wafer” testing has become highly sophisticated, with special test structures typically incorporated in the kerf areas between individual dies on a wafer, so that during fabrication, measurements made on these structures can determine if device performance will fall within specification limits.
问题补充： |
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2013-05-23 12:21:38
正在翻译，请等待...
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2013-05-23 12:23:18
这种"过程"和"关于晶片”测试已成为高度复杂,特殊的测试结构通常在厚度方面个人去世一个晶圆上,因此,在制造、测量这些结构可以确定设备的性能将会下降规格极限值范围内。
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2013-05-23 12:24:58
正在翻译，请等待...
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2013-05-23 12:26:38
这个"过程"和"外延片"的测试已经成为高度复杂的具有特殊的测试结构通常列入之间个人死在晶圆上的切口区域以便在制造过程中对这些结构进行测量可以确定是否设备性能会在规格范围内。
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2013-05-23 12:28:18
正在翻译，请等待...
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