求翻译：EG-60 是為有利於SMT與晶片封裝而特別設計的置換型化學金電鍍，因此在鍍金之前，在基材上實行充分的鎳沉積是必需的(4μm以上為佳)。為此目的，我們建議用 EN-51系列作為化學鎳的溶液。是什么意思？

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Eg-60 is to facilitate SMT and chip package specifically designed replace-chemical key plating, so the gold-plated prior to base material on the nickel deposition is required (4?m or higher is better). For this purpose, we recommend that the EN-51 series as chemical nickel of the solution.

EG-60 is for is advantageous to SMT and the replacement chemistry gold galvanization which but the chip seal designs specially, therefore before gold-plating, implements the full nickel deposition in the parent metal is essential( 4μm above for good).For this goal, we suggest with the EN-51 series a

EG-60 is for the benefit of SMT chip packaging specially designed replacement type electroless gold plating, so before the gilded, in full nickel deposit on the substrate is required (4 μ m or more is better). To this end, we recommend that you use the EN-51 series as electroless nickel solution.

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