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  • 匿名
关注:1 2013-05-23 12:21

求翻译:此批RMA有許多台因PCB受潮而損壞,故也不排除因受潮通電而導致Bonding IC損壞是什么意思?

待解决 悬赏分:1 - 离问题结束还有
此批RMA有許多台因PCB受潮而損壞,故也不排除因受潮通電而導致Bonding IC損壞
问题补充:

  • 匿名
2013-05-23 12:21:38
正在翻译,请等待...
  • 匿名
2013-05-23 12:23:18
This batch RMA there are many console PCB gets wet and damage, it also does not eliminate moisture is powered on and cause bonding IC damage
  • 匿名
2013-05-23 12:24:58
Because this batch of RMA has many PCB to be affected with damp damages, therefore does not remove because of the moisture circular telegram causes Bonding the IC damage
  • 匿名
2013-05-23 12:26:38
This RMA number for PCB from moisture damage, nor does it preclude Bonding due to damp power IC damaged
  • 匿名
2013-05-23 12:28:18
正在翻译,请等待...
 
 
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