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关注：1
2013-05-23 12:21
求翻译：由于COMPONCNT SIDE and SOLDER SIDE 铜面积相差30% 并且只有一面工艺边，分板时会产生应力，易造成板弯翘是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
由于COMPONCNT SIDE and SOLDER SIDE 铜面积相差30% 并且只有一面工艺边，分板时会产生应力，易造成板弯翘
问题补充： |
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2013-05-23 12:21:38
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2013-05-23 12:23:18
As a result of the SIDE and SOLDER COMPONCNT SIDE area and 30 per cent of the difference between the copper only one side of the process, the score board will create strain relief to board warping
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2013-05-23 12:24:58
And because COMPONCNT SIDE and SOLDER the SIDE copper area differs 30% only then at the same time nearby the craft, divides when the board can have the stress, easy to make the forming warpage
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2013-05-23 12:26:38
Due to the COMPONCNT SIDE and SOLDER SIDE copper area is 30% and only one process edges, panels will generate stress, cause warping
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2013-05-23 12:28:18
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