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关注：1
2013-05-23 12:21
求翻译：集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅
问题补充： |
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2013-05-23 12:21:38
Integrated circuit Flip Chip packages semiconductor die and carrier to form a viable electrical connection between the Lead in solders
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2013-05-23 12:23:18
IC flip chip packaging semiconductor chip and carriers reliable connectivity between the use of lead in solder used
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2013-05-23 12:24:58
The integrated circuit inverts in the chip seal between the semiconductor chip and the carrier forms the reliable joint to use in the solder the lead
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2013-05-23 12:26:38
Integrated circuit semiconductor chips in flip-chip packaging and carrier form reliable joins between the use of lead in solder
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2013-05-23 12:28:18
Integrated circuit semiconductor chips in flip-chip packaging and carrier form reliable joins between the use of lead in solder
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