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关注：1
2013-05-23 12:21
求翻译：时发挥芯片整体封装特点是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
时发挥芯片整体封装特点
问题补充： |
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2013-05-23 12:21:38
Characteristics of the chip to play the whole package
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2013-05-23 12:23:18
Play when whole chip packaging features
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2013-05-23 12:24:58
When displays the chip whole seal characteristic
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2013-05-23 12:26:38
Play chips overall package features
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2013-05-23 12:28:18
Characteristics of the chip to play the whole package
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