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关注：1
2013-05-23 12:21
求翻译：Sputtering sources contain no hot parts (to avoid heating they are typically water cooled) and are compatible with reactive gases such as oxygen. Sputtering can be performed top-down while evaporation must be performed bottom-up. Advanced processes such as epitaxial growth are possible是什么意思？ 待解决
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Sputtering sources contain no hot parts (to avoid heating they are typically water cooled) and are compatible with reactive gases such as oxygen. Sputtering can be performed top-down while evaporation must be performed bottom-up. Advanced processes such as epitaxial growth are possible
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2013-05-23 12:21:38
溅射源不包含高温部件（避免加热它们通常水冷）和活性气体如氧气兼容。溅射可以进行自上而下，而蒸发必须执行自下而上。先进的工艺，如外延生长是可能的
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2013-05-23 12:23:18
溅射来源不包含热点地区(以避免暖气他们通常水冷)和符合活性气体如氧气。 溅射能进行由上而下蒸发而必须进行自下而上。 先进的工艺如外延增长可能是
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2013-05-23 12:24:58
正在翻译，请等待...
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2013-05-23 12:26:38
溅射源包含没有热部件 （以避免它们通常是水冷的加热），如氧活性气体与兼容。溅射可以执行的自上而下而蒸发必须执行自底向上。先进的流程如外延生长有可能
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2013-05-23 12:28:18
溅射源不包含高温部件（避免加热它们通常水冷）和活性气体如氧气兼容。溅射可以进行自上而下，而蒸发必须执行自下而上。先进的工艺，如外延生长是可能的
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