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  • 匿名
关注:1 2013-05-23 12:21

求翻译:一般在1000℃的条件下保温保压30min后淬冷发生完全合金化未掺杂的β-FeSi2是P型半导体,而掺杂可以使载流子的浓度增大,降低材料的电阻率。是什么意思?

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一般在1000℃的条件下保温保压30min后淬冷发生完全合金化未掺杂的β-FeSi2是P型半导体,而掺杂可以使载流子的浓度增大,降低材料的电阻率。
问题补充:

  • 匿名
2013-05-23 12:21:38
Generally at 1000 ℃ under the conditions of thermal quenching packing occurred after 30min completely undoped alloy is a P-type β-FeSi2 semiconductor, and doping can make the carrier concentration increases, the lower resistivity of the material.
  • 匿名
2013-05-23 12:23:18
Generally speaking, in 1000 under the conditions of the °C insulated dwelling 30 min after full alloy of quenching cold occurred not adulterated with beta-FeSi P Semiconductor is 2, and can be mixed with the carrier to lower increase in the concentration of the resistivity of the material.
  • 匿名
2013-05-23 12:24:58
Generally after 1000℃ the condition keeps warm guarantees presses 30min to quench has the complete alloy doping β-FeSi 2 has not been the P semiconductor, but dopes may cause the current carrier the density to increase, reduces material the electronic resistivity.
  • 匿名
2013-05-23 12:26:38
General conditions of 1000 degrees Celsius after a 30min of insulation quenched completely alloy doped β-FeSi2 is p-type semiconductor, and doped allows a carrier concentration increases, reducing the resistivity of the material.
  • 匿名
2013-05-23 12:28:18
Generally at 1000 ℃ under the conditions of thermal quenching packing occurred after 30min completely undoped alloy is a P-type β-FeSi2 semiconductor, and doping can make the carrier concentration increases, the lower resistivity of the material.
 
 
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