求翻译：随着电子电路产品向着小型化、智能化、高频率、高可靠性方向的快速发展，电路模块在电子电路产品中的使用越来越广泛，但是电路模块具有的频率高、密度高、可靠性要求高等特性，使其组装难度增大，导致组装质量下降，从而产生了可靠性低、产品合格率低，返修率高、影响产品研制周期等一系列问题。其组装质量已成为影响设备高可靠、高性能、正常工作的重要因素之一。因此，急需开展对电路模块组装质量的测控技术研究。是什么意思？

With the product toward the miniaturization of electronic circuits, intelligent, high-frequency, high reliability, the direction of the rapid development of electronic circuits in the circuit module products in the more widely used, but the frequency of the circuit module with high density, high rel

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Turns towards miniaturized, intellectualized, the high-frequency, the redundant reliable direction fast developm

As electronic circuit products towards miniaturization, and intelligent of, and high frequency, and high reliability direction of fast development, circuit module in electronic circuit products in the of using increasingly widely, but circuit module has of frequency high, and density high, and relia