求翻译：多层组合一体化压电陶瓷芯片是由高灵敏度压电陶瓷材料和内部电极作成厚度约0.1mm的薄层，共23层，在高温高压状态下烧结成一个整体。其形状是一个中心有孔的圆片（Φ25mm×Φ3.2mm×2.6mm）。多层组合一体化压电陶瓷芯片就是压电加速度地震检波器的核心器件。是什么意思？

Integration of piezoelectric multi-layer ceramic chip by high-sensitivity piezoelectric ceramic material and internal electrode made of a thin layer of thickness of about 0.1mm, a total of 23 layers, sintered at high temperature and pressure conditions as a whole. Its shape is a center hole of the w

The integration of multi-layer piezoelectric ceramic chip is composed of high-sensitivity piezoelectric ceramic materials and internal electrode 32,34 approximately 0.1 mm thickness of TLC, for a total of 23 floors, under high pressure and temperature condition burned into an integrated whole. its s

The multi-layered combination integration piezoelectricity ceramics chip is makes thickness approximately 0.1mm by the high sensitivity piezoelectricity ceramic material and internal electrode the thin layer, altogether 23, the agglutination become a whole under the high temperature high pressure co

Integration of multilayer composite Piezoelectric ceramic chip is composed of Piezoelectric ceramic material with high sensitivity and internal electrodes into a thin layer of thickness 0.1mm, a total of 23, under high temperature and high pressure state burnt to form a whole. Its shape is the centr

Multilayer it makes up integrated piezoelectric ceramic chip to be to make thickness about thin layer of 0.1mm by high sensitivity piezoelectric ceramic material and internal electrode, amounts to 23 floors, burn and form a whole in high-temperature and high-pressure condition. Its shape is round sl