求翻译：摘要:介绍了集成电路铜互连双嵌入式工艺和电镀铜的原理;有机添加剂在电镀铜中的重要作用及对添加剂含量的监测技术;脉冲电镀和化学电镀在铜互连技术中的应用;以及铜互连电镀工艺的发展动态。是什么意思？

Abstract: IC copper interconnect pairs of embedded technology and the principle of electroplating copper; the important role of organic additives in electroplating copper and additive content monitoring technology; pulse electroplating and chemical plating in copper interconnect technology; and copp

Summary: Describes the IC copper interconnect dual embedded technology and how it works; the copper plating organic additives in the plated copper, and the important role of technology for the monitoring of the additive levels; Pulse plating and chemical plating the copper interconnect technology; a

Abstract: Introduced the integrated circuit copper interlocks the double embedded craft and the electrocoppering principle; Organic chemical additive in electrocoppering vital role and to additive level monitor technology; Pulse galvanization and chemistry galvanization in copper interconnection tec

Summary: introduces integrated circuit dual embedded copper interconnection process and principle of electroplating copper, organic additives in copper plating on the important role of monitoring technology of additives content; pulse electroplating and chemical plating in application of copper inte

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