求翻译：在铜电镀过程中,对填充过程产生影响的主要是加速剂、抑制剂和氯离子,填充过程完成后对镀层表面粗糙度产生影响的主要是平坦剂。铜电镀是有机添加剂共同作用的结果,它们之间彼此竞争又相互关联。为实现无空洞和无缺陷电镀,除了改进添加剂的单个性能外,还需要确定几种添加剂同时存在时各添加剂浓度的恰当值,使三者之间互相平衡,才能达到良好的综合性能,得到低电阻率、结构致密和表面粗糙度小的铜镀层。是什么意思？

Impact on the filling process in the copper plating process, the main accelerators, inhibitors and chloride ions on the coating surface roughness after the completion of the filling process impact is mainly flat agent. Copper plating is the result of the role of organic additives, and they compete w

In the Copper plating process, have an impact on the filling process is accelerated, mainly inhibitors and chloride ions, and fill process is complete the plating surface roughness effects are mainly flat. Copper plating is organic additives, the competition between them are interrelated. To achieve

Copper electroplating process, mainly have an impact on the population process accelerating agent for, inhibitors and chlorine ions, filling process is completed on the coating surface roughness effects mainly flat agent. Copper plating is the result of both organic additives, competition between th