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关注：1 2013-05-23 12:21

求翻译：the document describes the design and assembly challenge for implementing BGA and fine pitch BGA technology.the effect of BGA and fine pitch BGA technology on current technology and component typies is also address是什么意思？

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the document describes the design and assembly challenge for implementing BGA and fine pitch BGA technology.the effect of BGA and fine pitch BGA technology on current technology and component typies is also address
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  • 匿名
2013-05-23 12:26:38
该文档介绍的设计和装配的挑战，为实施 BGA 和细间距的 BGA BGA 技术效果和细间距对当前技术和组件类型的 BGA 技术也是地址
 
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