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关注：1
2013-05-23 12:21
求翻译：the document describes the design and assembly challenge for implementing BGA and fine pitch BGA technology.the effect of BGA and fine pitch BGA technology on current technology and component types is also addressed是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
the document describes the design and assembly challenge for implementing BGA and fine pitch BGA technology.the effect of BGA and fine pitch BGA technology on current technology and component types is also addressed
问题补充： |
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