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  • 匿名
关注:1 2013-05-23 12:21

求翻译:为什么会出现此种中空的缺陷形状,分析认为,B阶状态的环氧胶系流动性有一定的限制,当温度到达其熔融点时,在垂直无外力状态下其并不会像水滴一样往下流(例如图6(b)中部的胶,下部不受力,其依然粘在PI层不会流下,因而下部中空),而只有当外界施加压力传递到胶层受力时,且存在压力差的状态下胶才能从高压处往低压处流动,因而在导线边缘处,其近似于作垂直流动,在大间距的中部,胶层由于PI的足够形变挤压,因而向两边平行流动(如图4(C)箭头)。正是这些变形力的的推动作用,使得空隙中的胶层重新分布。如果线距的宽度使得水平流动和垂直流动刚好能到达,则空隙能填满,如果线距在某一范围内,溢胶量和水平流动均不足以填充,则最易在如图6的位置出现缺胶分层区。是什么意思?

待解决 悬赏分:1 - 离问题结束还有
为什么会出现此种中空的缺陷形状,分析认为,B阶状态的环氧胶系流动性有一定的限制,当温度到达其熔融点时,在垂直无外力状态下其并不会像水滴一样往下流(例如图6(b)中部的胶,下部不受力,其依然粘在PI层不会流下,因而下部中空),而只有当外界施加压力传递到胶层受力时,且存在压力差的状态下胶才能从高压处往低压处流动,因而在导线边缘处,其近似于作垂直流动,在大间距的中部,胶层由于PI的足够形变挤压,因而向两边平行流动(如图4(C)箭头)。正是这些变形力的的推动作用,使得空隙中的胶层重新分布。如果线距的宽度使得水平流动和垂直流动刚好能到达,则空隙能填满,如果线距在某一范围内,溢胶量和水平流动均不足以填充,则最易在如图6的位置出现缺胶分层区。
问题补充:

  • 匿名
2013-05-23 12:26:38
Why will appears this species hollow of defects shape, analysis think, b-order state of ring oxygen glue Department liquidity has must of limit, dang temperature arrived its melting point Shi, in vertical no forces State Xia its and not like drops as down flow (for example Figure 6 (b) Central of glue, lower not by force, its still viscosity in PI layer not shed, thus lower hollow), and only Dang outside pressure passed to glue layer by force Shi, and exists pressure difference of State Xia glue to from high pressure Department to low voltage Department flow, thus in wire edge Department, its approximate Yu for vertical flow, in large spacing of Central, glue layer because PI of enough deformation extrusion, thus to on both sides parallel flow (as Figure 4 (c) arrow). It is these deformation force of impetus, allows redistribution of voids in the adhesive layer. If the width of the line from horizontal flow and vertical flow just in reach, the voids to fill up, if the line spacing in a range, overflow and horizontal flows are not sufficient to fill, then the location of the most vulnerable in Figure 6 there was a shortage of rubber layer.
 
 
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