求翻译：由表4可知，当胶厚/铜厚为0.786时，压力和时间对其影响不大，均能完全填充，这也进一步证实了3.1中所述的比值大于0.7时能满足压合质量要求，同时也可以据此得出启示，如果选择胶厚较大，可以适当减少压合时间可提高生产效率。是什么意思？

Table 4, when the adhesive thickness/copper thickness at 0.786, pressure and time to have little impact, will completely fill, this is also confirmed as described in 3.1 ratio is greater than 0.7 to meet quality requirements, but also to draw inspiration, if you choose to glue thickness larger, can be appropriate to reduce pressing time can improve production efficiency.