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关注:1
2013-05-23 12:21
求翻译:Copper electroplating is used for depositing copper in the dual damascene metallization scheme.Electroplating configures the wafer as a cathode and immerses it into an electrolytic solution.Copper is deposited from a positive anode made of copper.是什么意思? 待解决
悬赏分:1
- 离问题结束还有
Copper electroplating is used for depositing copper in the dual damascene metallization scheme.Electroplating configures the wafer as a cathode and immerses it into an electrolytic solution.Copper is deposited from a positive anode made of copper.
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2013-05-23 12:21:38
铜电镀铜存放在双镶嵌金属scheme.Electroplating配置作为阴极晶圆和沉浸到电解solution.Copper交存作出了积极的阳极铜。
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2013-05-23 12:23:18
铜电镀铜是用于存放在双重Damascene Sindikubwabo metallization计划电镀配置的晶片为阴极和进入遐想它变成一电解解决铜是从一个积极阳极作出交存的铜。
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2013-05-23 12:24:58
铜电镀为放置铜使用在双重波状花纹的金属化计划。电镀配置薄酥饼作为负极并且浸没它入一种电解解答。铜从正面阳极被放置由铜制成。
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2013-05-23 12:26:38
电镀铜用于镀铜双金属镶嵌化计划。电镀阴极配置晶圆片和它沉浸到电解的解决方案。铜被存放从正面阳极铜制。
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2013-05-23 12:28:18
铜电镀铜存放在双镶嵌金属scheme.Electroplating配置作为阴极晶圆和沉浸到电解solution.Copper交存作出了积极的阳极铜。
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