求翻译：图6为不同线距的填胶缺陷图，由切片可以看出，实际情况跟分析吻合，当胶厚较小时，PI膜与铜箔紧密结合，两者之间的胶顺着边缘流入空隙，在铜边缘处由于导线上方的胶全部流入可以填充完全，而出现缺陷区域一般在离最大落差铜边缘一小段距离之处开始。是什么意思？

Figure 6 for different line from of fill glue defects figure, by slice can see, reality with analysis anastomosis, dang glue thick smaller Shi, PI film and copper foil close combination, both Zhijian of glue along edge inflow gap, in copper edge Department because wire above of glue all inflow can fill full, and appears defects regional General in away from maximum fall copper edge a small segment distance of Department began.