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关注：1
2013-05-23 12:21
求翻译：芯片貼好后，表面需要貼平，無氣泡，無折叠是什么意思？ 待解决
 悬赏分：1
- 离问题结束还有
芯片貼好后，表面需要貼平，無氣泡，無折叠
问题补充： |
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2013-05-23 12:21:38
After die attach , surface needs to stick flat , no bubbles, no fold
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2013-05-23 12:23:18
After the chip pastes, the surface needs to paste the draw, does not have the air bubble, does not have the fold
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2013-05-23 12:24:58
After the chip pastes, the surface needs to paste evenly, does not have the air bubble, does not have the fold
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2013-05-23 12:26:38
Chip in place, need to stick on the surface, no bubbles, no folding
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2013-05-23 12:28:18
正在翻译，请等待...
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